Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10863629 | Method of manufacturing through hole of substrate | Kiyoyuki Hatanaka, Shigeru Sugino, Takahiro Kitagawa, Ryo Kanai, Nobuo Taketomi | 2020-12-08 |
| 10783309 | Method for outputting impact degree and information processing device | Yoshiyuki Hiroshima, Takahiro Kitagawa, Akiko Matsui, Naoki Nakamura | 2020-09-22 |
| 10624216 | Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring board | Nobuo Taketomi, Takahiro Kitagawa, Shigeru Sugino, Kiyoyuki Hatanaka, Shigeo Iriguchi +1 more | 2020-04-14 |