Issued Patents 2020
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10872758 | SiC wafer producing method | — | 2020-12-22 |
| 10872757 | Semiconductor substrate processing method | — | 2020-12-22 |
| 10870176 | SiC wafer producing method | — | 2020-12-22 |
| 10870169 | Laser processing apparatus and wafer producing method | Yasuyoshi Yubira | 2020-12-22 |
| 10828726 | SiC wafer producing method using ultrasonic wave | Ryohei Yamamoto | 2020-11-10 |
| 10799987 | Laser processing apparatus | Kentaro Iizuka, Koyo Honoki, Shuichi Torii, Yutaka Kobayashi, Ryohei Yamamoto | 2020-10-13 |
| 10774445 | Wafer production method | — | 2020-09-15 |
| 10755946 | Method for producing a wafer from a hexagonal single crystal ingot by applying a laser beam to form a first production history, an exfoliation layer, and a second production history | Ryohei Yamamoto | 2020-08-25 |
| 10714353 | Planarization method | — | 2020-07-14 |
| 10655632 | Shaft seal device and vertical pump with this shaft seal device | Yasushi Kawai | 2020-05-19 |
| 10625371 | Wafer producing method | Kunimitsu Takahashi, Yoko Nishino | 2020-04-21 |
| 10610973 | Wafer producing method | — | 2020-04-07 |
| 10573505 | SiC wafer producing method | — | 2020-02-25 |
| 10563321 | Wafer producing method | — | 2020-02-18 |