Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784164 | Method of dividing wafer | — | 2020-09-22 |
| 10727127 | Method of processing a substrate | Hiroshi Morikazu, Nao Hattori | 2020-07-28 |
| 10727128 | Method of processing a wafer | Roland Zimmermann, Hitoshi Hoshino | 2020-07-28 |
| 10702946 | Substrate processing method | Hiroshi Morikazu, Nao Hattori | 2020-07-07 |
| 10682728 | Method of processing a substrate | Hitoshi Hoshino, Kenji Furuta | 2020-06-16 |