Issued Patents 2020
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10869413 | Heat-dissipating component and method for manufacturing same | Motonori Kino | 2020-12-15 |
| 10751912 | Aluminum-diamond-based composite and method for producing same | Hiroaki Ota, Yosuke Ishihara | 2020-08-25 |
| 10640853 | Aluminum-diamond-based composite and heat dissipation component | Yosuke Ishihara, Hideo Tsukamoto, Kazunori KOYANAGI | 2020-05-05 |
| 10636723 | Heat dissipation component and method for manufacturing same | Daisuke Goto, Yosuke Ishihara | 2020-04-28 |
| 10541189 | Heat dissipation component for semiconductor element | Yosuke Ishihara, Hiroaki Ota, Hideo Tsukamoto | 2020-01-21 |
| 10539379 | Heat dissipation component for semiconductor element | Yosuke Ishihara, Kazunori KOYANAGI | 2020-01-21 |
| 10529591 | Method for producing silicon carbide composite material | Daisuke Goto | 2020-01-07 |