Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10640853 | Aluminum-diamond-based composite and heat dissipation component | Yosuke Ishihara, Takeshi Miyakawa, Hideo Tsukamoto | 2020-05-05 |
| 10539379 | Heat dissipation component for semiconductor element | Yosuke Ishihara, Takeshi Miyakawa | 2020-01-21 |