Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10572622 | Interconnect reuse resolution with bump compensation in a package design | Frank Bader | 2020-02-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10572622 | Interconnect reuse resolution with bump compensation in a package design | Frank Bader | 2020-02-25 |