Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10572622 | Interconnect reuse resolution with bump compensation in a package design | John Medina | 2020-02-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10572622 | Interconnect reuse resolution with bump compensation in a package design | John Medina | 2020-02-25 |