Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832995 | Power module | Frank Osterwald | 2020-11-10 |
| 10814396 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Holger Ulrich | 2020-10-27 |
| 10818633 | Sintering tool for the lower die of a sintering device | Frank Osterwald, Martin Becker, Jacek Rudzki, Lars Paulsen, Holger Ulrich | 2020-10-27 |
| 10685894 | Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component | — | 2020-06-16 |
| 10607962 | Method for manufacturing semiconductor chips | Frank Osterwald, Martin Becker, Holger Ulrich, Jacek Rudzki | 2020-03-31 |
| 10593608 | Semiconductor module comprising an encapsulating compound that covers at least one semiconductor component | Anton-Zoran MIRIC, Frank Krüger, Wolfgang Schmitt | 2020-03-17 |