Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10814396 | Sintering tool and method for sintering an electronic subassembly | Frank Osterwald, Martin Becker, Lars Paulsen, Jacek Rudzki, Ronald Eisele | 2020-10-27 |
| 10818633 | Sintering tool for the lower die of a sintering device | Frank Osterwald, Ronald Eisele, Martin Becker, Jacek Rudzki, Lars Paulsen | 2020-10-27 |
| 10622331 | Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component | Andreas Hinrich, Susanne Klaudia DUCH, Anton-Zoran MIRIC, Michael Schäfer, Christian Bachmann +6 more | 2020-04-14 |
| 10607962 | Method for manufacturing semiconductor chips | Frank Osterwald, Martin Becker, Ronald Eisele, Jacek Rudzki | 2020-03-31 |