Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854493 | Method for manufacturing a handling device and method for reversible bonding using such a device | Pierre Montmeat | 2020-12-01 |
| 10643884 | Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer | Elodie Beche, Vincent Larrey | 2020-05-05 |