Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643884 | Method for manufacturing a semiconductor structure with temporary direct bonding using a porous layer | Frank Fournel, Vincent Larrey | 2020-05-05 |
EB
Elodie Beche
Overall (2020): #482,727 of 565,922Top 90%
1
Patents 2020