Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10880988 | Highly thermally conductive dielectric structure for heat spreading in component carrier | Jonathan Silvano de Sousa, Hannes Voraberger | 2020-12-29 |
| 10790234 | Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure | Marco Gavagnin, Martin Schrems, Roland Winkler, Steve Anderson | 2020-09-29 |
| 10736222 | Cooling component carrier material by carbon structure within dielectric shell | Jonathan Silvano de Sousa, Walter Pessl | 2020-08-04 |
| 10568210 | Electronic device with embedded electronic component | Christian Galler, Gerhard Stubenberger, Wolfgang Schrittwieser | 2020-02-18 |