Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10880988 | Highly thermally conductive dielectric structure for heat spreading in component carrier | Jonathan Silvano de Sousa, Markus Leitgeb | 2020-12-29 |
| 10765005 | Embedding component with pre-connected pillar in component carrier | Hannes Stahr, Andreas Zluc, Bettina Schuster | 2020-09-01 |