Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685897 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2020-06-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685897 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2020-06-16 |