Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10685897 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Jae Doo Kwon, Hyung Il Jeon | 2020-06-16 |
| 10645613 | Method and apparatus for generating packet in mobile communication system | Han Na Lim, Sung Won Lee, Jung-Shin Park | 2020-05-05 |