Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840138 | Selectively etched self-aligned via processes | Yung-Chen Lin, Ying Zhang, Ho-yung David Hwang | 2020-11-17 |
| 10770568 | Method to remove III-V materials in high aspect ratio structures | Xinyu BAO, Ying Zhang, YungChen Lin | 2020-09-08 |
| 10741393 | Methods for bottom up fin structure formation | Yung-Chen Lin, Xinyu BAO, Ying Zhang | 2020-08-11 |
| 10692728 | Use of selective aluminum oxide etch | Ying Zhang, Yung-Chen Lin | 2020-06-23 |
| 10593594 | Selectively etched self-aligned via processes | Yung-Chen Lin, Ying Zhang, Ho-yung David Hwang, Uday Mitra, Regina Freed | 2020-03-17 |