Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818632 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Chonghua Zhong, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2020-10-27 |
| 10770433 | High bandwidth die to die interconnect with package area reduction | Chonghua Zhong, Kunzhong Hu | 2020-09-08 |
| 10756622 | Power management system switched capacitor voltage regulator with integrated passive device | Sanjay Dabral, David A. Secker, Ralf M. Schmitt, Vidhya Ramachandran, Wenjie Mao | 2020-08-25 |
| 10685948 | Double side mounted large MCM package with memory channel length reduction | Chonghua Zhong, Kunzhong Hu | 2020-06-16 |
| 10631410 | Stacked printed circuit board packages | Corey S. Provencher, Meng Chi Lee, Derek Walters, Ian A. Spraggs, Flynn Carson +9 more | 2020-04-21 |