Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818632 | Structure and method for fabricating a computing system with an integrated voltage regulator module | Vidhya Ramachandran, Jun Zhai, Kunzhong Hu, Shawn Searles, Joseph T. DiBene, II +1 more | 2020-10-27 |
| 10770433 | High bandwidth die to die interconnect with package area reduction | Jun Zhai, Kunzhong Hu | 2020-09-08 |
| 10685948 | Double side mounted large MCM package with memory channel length reduction | Jun Zhai, Kunzhong Hu | 2020-06-16 |