Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672715 | Semiconductor package using cavity substrate and manufacturing methods | Young Do Kweon, JeongByung Chae, ByoungWoo Cho, SeHwan Hong | 2020-06-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672715 | Semiconductor package using cavity substrate and manufacturing methods | Young Do Kweon, JeongByung Chae, ByoungWoo Cho, SeHwan Hong | 2020-06-02 |