Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672715 | Semiconductor package using cavity substrate and manufacturing methods | JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong | 2020-06-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10672715 | Semiconductor package using cavity substrate and manufacturing methods | JeongByung Chae, DongJoo Park, ByoungWoo Cho, SeHwan Hong | 2020-06-02 |