Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10873445 | Deskewing method for a physical layer interface on a multi-chip module | Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi +6 more | 2020-12-22 | $177,143,000 |
| 10656696 | Reducing chiplet wakeup latency | Benjamin Tsien, Ivan Yanfeng Wang, Kevin M. Lepak, Ann Ling, Richard Martin Born +3 more | 2020-05-19 | $54,061,000 |
| 10581587 | Deskewing method for a physical layer interface on a multi-chip module | Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi +6 more | 2020-03-03 | $32,225,000 |
| 10541841 | Hardware transmit equalization for high speed | Shiqi Sun, Yanfeng Wang | 2020-01-21 | $74,103,000 |