Issued Patents 2020
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854527 | Semiconductor device package and method of manufacturing the same | — | 2020-12-01 |
| 10818636 | Substrate panel structure and manufacturing process | Jen-Kuang Fang | 2020-10-27 |
| 10818586 | Substrate structure and method of manufacturing the same | — | 2020-10-27 |
| 10796987 | Semiconductor device package and method of manufacturing the same | Huang-Hsien Chang | 2020-10-06 |
| 10714403 | Semiconductor device package with patterned conductive layers and an interconnecting structure | — | 2020-07-14 |
| 10700029 | Semiconductor package device and method of manufacturing the same | — | 2020-06-30 |
| 10692804 | Semiconductor device package and method of manufacturing the same | — | 2020-06-23 |
| 10685934 | Semiconductor package device and method of manufacturing the same | Jen-Kuang Fang | 2020-06-16 |
| 10672696 | Semiconductor device package | Jen-Kuang Fang | 2020-06-02 |
| 10658306 | Semiconductor package structure and method of manufacturing the same | — | 2020-05-19 |
| 10658298 | Semiconductor device package and method for manufacturing the same | — | 2020-05-19 |
| 10658280 | Electrical device including a through-silicon via structure | — | 2020-05-19 |
| 10636745 | Semiconductor package device and method of manufacturing the same | Jen-Kuang Fang | 2020-04-28 |
| 10629558 | Electronic device | — | 2020-04-21 |
| 10566279 | Package device, semiconductor device, and method for manufacturing the package device | Jen-Kuang Fang, Min-Lung Huang, Chan Wen Liu, Ching Kuo Hsu | 2020-02-18 |
| 10529664 | Electronic device and method of manufacturing the same | — | 2020-01-07 |