Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847470 | Semiconductor package structure and method for manufacturing the same | Guo-Cheng Liao, Yi Ding | 2020-11-24 |
| 10687419 | Semiconductor package device and method of manufacturing the same | Ming-Ze Lin, Yi Ding | 2020-06-16 |