Issued Patents 2020
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875947 | Ethylenic polymer and its use | Rajen M. Patel, Robert N. Cotton, Sharon L. Baker, Pradeep Jain, Jeffrey A. Sims +2 more | 2020-12-29 |
| 10857646 | Apparatus for chemical-mechanical polishing | Zhenjie Xu, Xiangyu Chen, Tongqing Wang, Kun Li, Xinchun Lu | 2020-12-08 |
| 10843484 | Shift circuit operating by using a capacitor, a printing head and printing device thereof | — | 2020-11-24 |
| 10816901 | Coater with automatic cleaning function and coater automatic cleaning method | Hui Wang, Fuping Chen, Wenjun Wang, Hongchao Yang, Voha Nuch +3 more | 2020-10-27 |
| 10804896 | Proximity magnetic induction switch control chip and its control method | — | 2020-10-13 |
| 10703869 | Polyethylene blend-composition suitable for blown films, and films made therefrom | Nilesh R. Savargaonkar, Mehmet Demirors, John W. Garnett, IV | 2020-07-07 |
| 10696828 | Ethylene/alpha-olefin copolymer composition, and articles comprising the same | Mridula Kapur, Mehmet Demirors, Douglas S. Ginger, Philip P. Fontaine, Amaia Bastero +1 more | 2020-06-30 |
| D885342 | Power adapter | — | 2020-05-26 |
| 10647840 | Thermoplastic compositions for electronics or telecommunication applications and shaped article therefore | Shijie Song, Zhenke Wei, Qin Wang, Mian Dai | 2020-05-12 |
| 10640272 | Packaging bag, apparatus and method for manufacturing film material of the packaging bag, and method of manufacturing the packaging bag | — | 2020-05-05 |
| 10633537 | Thermoplastic compositions having good dielectric and ductility properties | Wei Shan, Xing Liu | 2020-04-28 |
| 10626262 | Thermoplastic compositions with low dielectric constant and high stiffness and the shaped article therefore | Shijie Song | 2020-04-21 |
| 10615073 | Method for removing barrier layer for minimizing sidewall recess | Zhaowei Jia, Hui Wang | 2020-04-07 |
| 10589480 | Method and device for making net point of light guide plate | Shuiyin Wang | 2020-03-17 |
| 10557035 | Resin composition for high frequency electronic components | Shijie Song | 2020-02-11 |
| 10538652 | Low density ethylene-based polymer compositions with high melt strength and mid-high density control | Cornelis F. J. Den Doelder, Karl Zuercher, Otto J. Berbee, Teresa P. Karjala | 2020-01-21 |