Issued Patents 2019
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515878 | Semiconductor package with partial plating on contact side surfaces | Somchai Nondhasitthichai, Woraya Benjasukul | 2019-12-24 |
| 10361146 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Keith M. Edwards, Suebphong Yenrudee, Albert Loh | 2019-07-23 |
| 10325782 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Suebphong Yenrudee | 2019-06-18 |
| 10276477 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Keith M. Edwards, Suebphong Yenrudee, Albert Loh | 2019-04-30 |
| 10269686 | Method of improving adhesion between molding compounds and an apparatus thereof | Suebphong Yenrudee | 2019-04-23 |
| 10242953 | Semiconductor package with plated metal shielding and a method thereof | Suebphong Yenrudee, Chanapat Kongpoung, Sant Hongsongkiat, Siriwanna Ounkaew, Chatchawan Injan | 2019-03-26 |
| 10242934 | Semiconductor package with full plating on contact side surfaces and methods thereof | — | 2019-03-26 |
| 10204850 | Semiconductor package with partial plating on contact side surfaces | Somchai Nondhasitthichai, Woraya Benjavasukul | 2019-02-12 |