Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361146 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Saravuth Sirinorakul, Keith M. Edwards, Albert Loh | 2019-07-23 |
| 10325782 | Semiconductor package with multiple molding routing layers and a method of manufacturing the same | Saravuth Sirinorakul | 2019-06-18 |
| 10276477 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Saravuth Sirinorakul, Keith M. Edwards, Albert Loh | 2019-04-30 |
| 10269686 | Method of improving adhesion between molding compounds and an apparatus thereof | Saravuth Sirinorakul | 2019-04-23 |
| 10242953 | Semiconductor package with plated metal shielding and a method thereof | Chanapat Kongpoung, Sant Hongsongkiat, Siriwanna Ounkaew, Chatchawan Injan, Saravuth Sirinorakul | 2019-03-26 |