Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361146 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Saravuth Sirinorakul, Suebphong Yenrudee, Albert Loh | 2019-07-23 |
| 10276477 | Semiconductor package with multiple stacked leadframes and a method of manufacturing the same | Saravuth Sirinorakul, Suebphong Yenrudee, Albert Loh | 2019-04-30 |