Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497847 | Structure and manufacturing method of heat dissipation substrate and package structure and method thereof | Wen-Fang Liu, Shao-Chien Lee, Chen W. Tseng | 2019-12-03 |
| 10468570 | Circuit board and method for manufacturing the same | Po-Hsuan Liao | 2019-11-05 |