Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497847 | Structure and manufacturing method of heat dissipation substrate and package structure and method thereof | Shao-Chien Lee, Chen W. Tseng, Zong-Hua Li | 2019-12-03 |
| 10477701 | Circuit board and method for manufacturing the same | Po-Hsuan Liao | 2019-11-12 |
| 10356901 | Manufacturing method of circuit board structure | Ming-Hao Wu | 2019-07-16 |