Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497847 | Structure and manufacturing method of heat dissipation substrate and package structure and method thereof | Wen-Fang Liu, Chen W. Tseng, Zong-Hua Li | 2019-12-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497847 | Structure and manufacturing method of heat dissipation substrate and package structure and method thereof | Wen-Fang Liu, Chen W. Tseng, Zong-Hua Li | 2019-12-03 |