Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10324370 | Manufacturing method of circuit substrate and mask structure and manufacturing method thereof | Pu-Ju Lin, Shih-Lian Cheng, Cheng-Ta Ko, Jui-Jung Chien, Wei-Tse Ho | 2019-06-18 |
| 10211139 | Chip package structure | Tzyy-Jang Tseng, Ra-Min Tain | 2019-02-19 |