Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515870 | Package carrier having a mesh gas-permeable structure disposed in the through hole | Chin-Sheng Wang, Pei-Chang Huang | 2019-12-24 |
| 10211139 | Chip package structure | Tzyy-Jang Tseng, Yu-Hua Chen | 2019-02-19 |
| 10178755 | Circuit board stacked structure and method for forming the same | Kai-Ming Yang, Chien-Tsai Li | 2019-01-08 |