Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10271433 | Method of fabricating an electrical device package structure | Shu-Sheng Chiang, Tsung-Yuan Chen, Shih-Lian Cheng | 2019-04-23 |
| 10211139 | Chip package structure | Yu-Hua Chen, Ra-Min Tain | 2019-02-19 |