Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10411055 | Sensor package structure | Chun-Hua Chuang, Wen-Chung Huang, Chung-Hsien Hsin, Chen Peng | 2019-09-10 |
| 10340250 | Stack type sensor package structure | Jian-Ru Chen, Jo-Wei Yang, Hsiu-Wen Tu | 2019-07-02 |