Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340250 | Stack type sensor package structure | Jo-Wei Yang, LI-CHUN HUNG, Hsiu-Wen Tu | 2019-07-02 |
| 10236313 | Sensor package structure | Hsiu-Wen Tu, Chung-Hsien Hsin | 2019-03-19 |
| 10186538 | Sensor package structure | Hsiu-Wen Tu, Chung-Hsien Hsin | 2019-01-22 |