Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10411055 | Sensor package structure | Wen-Chung Huang, Chung-Hsien Hsin, Chen Peng, LI-CHUN HUNG | 2019-09-10 |
| 10240000 | Aromatic polyimides suitable for 3D printing processes | Roger W. Avakian, Ling Hu | 2019-03-26 |