Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366944 | Methods and apparatus for semiconductor device having bi-material die attach layer | Vikas Gupta | 2019-07-30 |
| 10347508 | Printed adhesion deposition to mitigate integrated circuit delamination | Yong Lin, Benjamin Stassen Cook, Abram Castro | 2019-07-09 |
| 10312212 | Self-adhesive die | — | 2019-06-04 |
| 10199348 | Plastic-packaged semiconductor device having wires with polymerized insulating layer | Abram Castro | 2019-02-05 |