Issued Patents 2019
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10520900 | Methods and apparatus for magnetically compensated chip scale atomic clock | Bradley Allen Kramer, Juan Alejandro Herbsommer | 2019-12-31 |
| 10498001 | Launch structures for a hermetically sealed cavity | Adam Joseph Fruehling, Juan Alejandro Herbsommer, Swaminathan Sankaran | 2019-12-03 |
| 10497651 | Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure | Daniel Lee Revier | 2019-12-03 |
| 10493722 | Hermetically sealed molecular spectroscopy cell with dual wafer bonding | Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs | 2019-12-03 |
| 10461810 | Launch topology for field confined near field communication system | Nathan Brooks, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun | 2019-10-29 |
| 10444432 | Galvanic signal path isolation in an encapsulated package using a photonic structure | Daniel Lee Revier | 2019-10-15 |
| 10444102 | Pressure measurement based on electromagnetic signal output of a cavity | Juan Alejandro Herbsommer, Adam Joseph Fruehling, Swaminathan Sankaran | 2019-10-15 |
| 10424551 | Integrated circuit wave device and method | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2019-09-24 |
| 10425793 | Staggered back-to-back launch topology with diagonal waveguides for field confined near field communication system | Swaminathan Sankaran, Nathan Brooks, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun | 2019-09-24 |
| 10424523 | Hermetically sealed molecular spectroscopy cell with buried ground plane | Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs | 2019-09-24 |
| 10389410 | Integrated artificial magnetic launch surface for near field communication system | Nathan Brooks, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun | 2019-08-20 |
| 10390433 | Methods of forming conductive and resistive circuit structures in an integrated circuit or printed circuit board | Juan Alejandro Herbsommer | 2019-08-20 |
| 10371891 | Integrated circuit with dielectric waveguide connector using photonic bandgap structure | Daniel Lee Revier | 2019-08-06 |
| 10374621 | Method and apparatus to reduce the leakage rate of a hermetic cavity | Juan Alejandro Herbsommer, S. Josh Jacobs | 2019-08-06 |
| 10354890 | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation | Yong Lin | 2019-07-16 |
| 10347508 | Printed adhesion deposition to mitigate integrated circuit delamination | Yong Lin, Rongwei Zhang, Abram Castro | 2019-07-09 |
| 10302860 | Matching impedance of a dielectric waveguide to a launching mechanism | Juan Alejandro Herbsommer | 2019-05-28 |
| 10256188 | Interconnect via with grown graphitic material | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2019-04-09 |
| 10233074 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2019-03-19 |
| 10181521 | Graphene heterolayers for electronic applications | Archana Venugopal, Luigi Colombo, Robert Reid Doering | 2019-01-15 |
| 10179730 | Electronic sensors with sensor die in package structure cavity | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2019-01-15 |
| 10170384 | Methods and apparatus providing a graded package for a semiconductor | Daniel Lee Revier | 2019-01-01 |
| 10171578 | Tapered coax launch structure for a near field communication system | Nathan Brooks, Swaminathan Sankaran, Bradley Allen Kramer, Mark W. Morgan, Baher Haroun | 2019-01-01 |