Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497651 | Electromagnetic interference shield within integrated circuit encapsulation using photonic bandgap structure | Benjamin Stassen Cook | 2019-12-03 |
| 10444432 | Galvanic signal path isolation in an encapsulated package using a photonic structure | Benjamin Stassen Cook | 2019-10-15 |
| 10371891 | Integrated circuit with dielectric waveguide connector using photonic bandgap structure | Benjamin Stassen Cook | 2019-08-06 |
| 10170384 | Methods and apparatus providing a graded package for a semiconductor | Benjamin Stassen Cook | 2019-01-01 |