Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10475729 | Packaged semiconductor device with a particle roughened surface | Daniel Yong Lin | 2019-11-12 |
| 10366944 | Methods and apparatus for semiconductor device having bi-material die attach layer | Rongwei Zhang | 2019-07-30 |
| 10186478 | Packaged semiconductor device with a particle roughened surface | Daniel Yong Lin | 2019-01-22 |