Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319695 | Semiconductor device and bump formation process | Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo +3 more | 2019-06-11 |
ZW
Zi-Zhong WANG
Overall (2019): #199,866 of 560,194Top 40%
1
Patents 2019