Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373885 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Chih Chiou, Wen-Ching Tsai | 2019-08-06 |
WL
Wen-Sen Lu
Overall (2019): #225,715 of 560,194Top 45%
1
Patents 2019