Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373885 | 3D stacked-chip package | Chen-Hua Yu, Ming-Fa Chen, Wen-Sen Lu, Wen-Chih Chiou | 2019-08-06 |
WT
Wen-Ching Tsai
Overall (2019): #225,258 of 560,194Top 45%
1
Patents 2019