Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522391 | Method and apparatus for back end of line semiconductor device processing | Chung-Wen Wu, Jyu-Horng Shieh | 2019-12-31 |
| 10515895 | Method of preventing pattern collapse | Chung-Wen Wu, Jeng-Shiou Chen, Jang-Shiang Tsai, Jyu-Horng Shieh | 2019-12-24 |
| 10504780 | Contact plug without seam hole and methods of forming the same | Jyu-Horng Shieh | 2019-12-10 |
| 10483397 | Fin field effect transistor and method of forming the same | Ju-Wang Hsu, Tang-Xuan Zhong, Yi-Nien Su, Jang-Shiang Tsai | 2019-11-19 |
| 10453794 | Interconnect structure for semiconductor devices | — | 2019-10-22 |
| 10354949 | Air gap structure and method | Jyu-Horng Shieh | 2019-07-16 |
| 10290538 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Jyu-Horng Shieh, Minghsing Tsai | 2019-05-14 |
| 10269632 | Semiconductor device and method | Ming-Hui Chu, Jyu-Horng Shieh | 2019-04-23 |
| 10170420 | Patterning approach for improved via landing profile | Chung-Wen Wu | 2019-01-01 |