Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510641 | Semiconductor device having backside interconnect structure on through substrate via and method of forming the same | Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih +3 more | 2019-12-17 |
| 10269611 | Method and apparatus for bonding semiconductor devices | Yan-Zuo Tsai, Yang-Chih Hsueh, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou | 2019-04-23 |