Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269611 | Method and apparatus for bonding semiconductor devices | Yang-Chih Hsueh, Chia-Yin Chen, Fu-Kang Tien, Ebin Liao, Wen-Chih Chiou | 2019-04-23 |
YT
Yan-Zuo Tsai
Overall (2019): #215,294 of 560,194Top 40%
1
Patents 2019