Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10307825 | Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder | Issei Okada, Yoshio Oka, Takashi Kasuga, Yasuhiro Okuda, Jinjoo Park +1 more | 2019-06-04 |
| 10292265 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Takashi Kasuga, Yoshio Oka, Shigeaki UEMURA, Shigeyoshi Nakayama, Jinjoo Park +2 more | 2019-05-14 |
| 10244627 | Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material | Kayo HASHIZUME, Yoshio Oka, Takashi Kasuga, Jinjoo Park, Hiroshi Ueda | 2019-03-26 |
| 10237976 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Takashi Kasuga, Yoshio Oka, Jinjoo Park, Sumito Uehara, Hiroshi Ueda | 2019-03-19 |