Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10307825 | Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder | Yoshio Oka, Takashi Kasuga, Yasuhiro Okuda, Jinjoo Park, Kousuke Miura +1 more | 2019-06-04 |