Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10244627 | Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material | Yoshio Oka, Takashi Kasuga, Jinjoo Park, Kousuke Miura, Hiroshi Ueda | 2019-03-26 |
| 10225931 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Yoshio Oka, Takashi Kasuga, Jinjoo Park, Hiroshi Ueda | 2019-03-05 |