Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403596 | Method of fabricating packaging structure | Shih-Ching Chen, Chieh-Lung Lai | 2019-09-03 |
| 10249562 | Package structure and fabrication method thereof | Ching-Wen Chiang, Kuang-Hsin Chen | 2019-04-02 |
| 10199320 | Method of fabricating electronic package | Ching-Wen Chiang, Kuang-Hsin Chen, Sheng-Li Lu | 2019-02-05 |